Active Cooling Systems

Active cooling, refers to cooling technologies that rely on an external device to enhance heat transfer. Through active cooling technologies, the rate of fluid flow increases during convection, which dramatically increases the rate of heat removal.

Active cooling solutions include forced air through a fan or blower, forced liquid, and thermoelectric coolers (TECs), which can be used to optimize thermal management on all levels. Fans are used when natural convection is insufficient to remove heat. They are commonly integrated into electronics, such as a computer case, or are attached to CPUs, hard drives or chipsets to maintain thermal conditions and reduce failure risk.

The main disadvantage of active thermal management is that it requires the use of electricity and therefore results in higher costs, compared to passive cooling.

Thermoelectric cooling system

A Thermoelectric cooling system uses the Peltier effect and uses a TEC that is semiconductor device that functions as a small heat pump.

Liquid Cooled Cold Plate

A Liquid Cooled Cold Plate removes high rates of heat in high power electronic components using a pump to circulate fluid through cold plates

Brazed Plate Heat Exchanger

A Brazed Plate Heat Exchanger is made by pressing a series of thin corrugated stainless steel together and brazed with copper or nickel.

Fan Heat Sink

A Fan Heat Sink is an active heat sink that provides its own airflow for more challenging thermal environments

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